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Thermal Management Handbook: For Electronic Assemblies
by J. Sergent & A. Krum
Publisher: McGraw-Hill
650 pages
From the publisher:
"Electronic systems have shrunk in size far faster than their
heat-producing power supplies, leading to major design and reliability
problems. This guide provides comprehensive information on the thermal
management of printed circuit boards, hybrid circuits, and multichip
modules, complete with data tables and a bounty of design examples.
Coverage of all thermal management issues in electronic packaging
addresses how to measure thermal properties of different materials--
assess heat loss in active devices, in conductor traces, and at high
frequencies--determine temperature at a given point or region in an
electronic assembly--conduct thermal analysis of common configurations
found in electronic assemblies--and cool electronic circuits.
The "hands-on" guide to thermal management! Thermal Management
Handbook. In recent years, heat-sensitive electronics systems have
been miniaturized far more than their heat-producing power supplies,
leading to major design and reliability challenges - and making thermal
management a critical design factor. This timely handbook is the most
current and comprehensive reference on the practical issues that any
packaging engineer must consider with regard to the thermal management
of printed circuit boards, hybrid circuits, and multichip modules.
In addition to presenting and exploring the three basic issues at the
core of effective thermal management - how and where the heat is
generated; how the temperature at a given point in the circuit is
determined; and how the heat is removed - the book is enhanced with
tutorial chapters, data tables, and a wealth of design examples.
Professionals will also benefit from the extensive data on material
properties and circuit functions, thus enabling more intelligent
decisions at the design state - and preventing thermal-related problems
from occurring in the first place."
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